The compact, space-saving wire bonder F & K M17S is a true multi-talent. In no time at all, it can be converted to all common wire bonding methods.
For maximum productivity at low operating costs, the application specialists at F&K Delvotec match the automation depth precisely to the customer’s product: Smartomation as a guarantee for low total cost of ownership.
M17 S is compatible with various bond methods
- Ball wedge bonding with heating
- Deep access bonding
- Wedge Wedge bonding, heavy wire and thin wire
The advantages
- M17 platform suitable for all wire bonding processes
- Quick and easy changeover in less than 15 minutes
- Versatile automation options from manual to inline
- Working area: X = 254 mm (10”) ; Y = 152mm (6”) ; Z = 40mm
- Continuous monitoring and active control of the bonding process through patented Bond Process Control
The options
- With lift system
- Manual pick-up
- Conveyor lines for in-line automation
- Customer-specific indexer system for components or workpiece carriers
