The fully automatic wire bonder F & K M17L not only offers the world’s largest working range for thin wire bonders. It can also be converted to bond heads for deep access or thick wire.
In addition, there is an enormous variety of automation options for manual component handling, single or dual track transport systems or even combined manual and automated component feeding. And all this in variants up to 500 mm clearance height for huge components.
M17 L is compatible with various bond methods
- Deep access bonding
- Wedge Wedge bonding, heavy wire and thin wire
The advantages
- Suitable for all common wire bonding processes
- Wire diameter 17 to 600 μm, max. ribbon cross-section 2,000 x 300 μm
- Quick and easy changeover in less than 15 minutes
- Large working range: 635 mm (X) x 350 mm (Y), 100 mm (Z); 25″ x 14″
- Continuous monitoring and control of the bonding process through patented Bond Process Control
- Wide range of automation options from manual to in-line, also combined or multi-track
- Variants for extremely high components up to 500 mm clearance height
The options
- Manual hand pick-up
- Conveyor lines for in-line automation
- Customised indexer system for components or workpiece carriers
