Solstice® S4

Advanced, single-wafer, high-throughput ECD and surface preparation, with up to four chambers

Key Benefits:

• Ideal for mid-level volume processing
• Smaller footprint and lower cost than Solstice S8
• High plating rates, excellent throughput
• Exceptional quality plating and surface prep
• Special processing chambers can substantially reduce plating costs
• Superior process control and excellent uniformity

The Solstice^® S4 automated electroplating systems are high-speed, fully -automated, 4-chamber tool designed for electroplating as well as surface preparation wet processing. The S4 provides all the essential features and capabilities of the S8, but with fewer chambers, a smaller footprint, and a lower price. The S4 can be ideal for users with simpler processing needs or who require an economical entry point into mid-level automated single-wafer electroplating production with enhanced process control.

The Solstice S4’s four chambers may be configured with a mix of different plating and surface prep chambers: GoldPro, CopperMax, Wet Etch, MLO, and Advanced Packaging.