Solstice® S8

Advanced single-wafer electroplating and surface preparation, with up to eight chambers

Key Benefits:

• Ideal for high- volume processing
• High plating rates, excellent throughput
• Exceptional quality plating and surface prep
• Special processing chambers can substantially reduce plating costs
• Superior process control and excellent uniformity

The Solstice^® S8 is the most powerful, easy-to-use, and cost-efficient route to single-wafer volume production for many applications. The fully automated chamber tool is designed for advanced wafer surface preparation and electroplating.

The S8 is engineered to deliver class-leading performance and exceptional operational flexibility. Its unique platform enables it to handle a spectrum of wet processes, from electroplating to high-pressure metal lift-off (MLO) to UBM etch and much more. The system is designed to accommodate many different substrate types, both transparent and opaque, from ultra thin to bonded. With its ability to deliver high-quality plating of a wide range of metals, the Solstice S8 can significantly reduce plating costs.

Solstice gives wet bench users an attractive, affordable, and easy upgrade path to the benefits of high-speed, cassette-to-cassette automated processing. The eight chambers of this system may be configured with a mix of different plating and surface prep chambers: GoldPro, CopperMax, Wet Etch, MLO, and Advanced Packaging.