Solstice® LT

Semi-automated single-wafer process development with up to three chambers

Key Benefits:

• Ideal for low-volume, R&D processing
• Economical entry to single-wafer processing
• Improved process quality and consistency
• Easy scale-up path to automated production
• Smallest Solstice system footprint

The Solstice^® LT a full-featured, easy-to-use for electroplating and surface preparation application, can process a broad range of wafer sizes down to 75mm. In addition to electroplating, the system can perform high-pressure metal lift-off (MLO) spray acid applications such as UBM etch, and more. The LT accommodates up to three chambers for manual-load, semi-automated process development, or low-volume or R&D production. The systems use the same software and controls, and the same selection of chambers as the Solstice S4 and S8 configurations, providing an easy scale-up to automated production as capacity need expand.

The Solstice LT system chambers may be configured with a mix of different plating and surface prep chambers, including: GoldPro, CopperMax, Wet Etch, MLO, and Advanced Packaging.