Highly productive and always with zero defects in view: The fully automatic, compact wire bonder F & K M17D has been specially adapted to the mass production of power semiconductors and power modules in the automotive industry.
It is the only wire bonder on the market that offers the possibility of bonding thin wire and thick wire or thick wire ribbons in one process on one machine.
M17 D is compatible with various bond methods
- Wedge Wedge bonding, heavy wire and thin wire
- Deep access bonding
The advantages
- Suitable for all common wire bonding processes
- Combination of thin wire and thick wire in one process
- Wire diameter 17 to 600 μm, max. ribbon cross-section 2,000 x 300 μm
- Quick and easy changeover in less than 15 minutes
- Extremely space-saving working ranges: X = 254 mm, Y = 153 mm, (optional 204 mm), Z = 40 mm (optional 60 mm)
- Continuous monitoring and control of the bonding process via Bond Process Control
- Various automation options from manual to in-line
The options
- With lift system
- Manual pick-up
- Conveyor lines for in-line automation
- Customer-specific indexer system for components or workpiece carriers
