T-6000-L

TRESKY’s entry-level model, the  DIE bonder T-6000-L, is a fully automatic placement system for universal and specific use in prototyping as well as series production.

The T-6000-L offers an unprecedented level of flexibility through a high degree of modularity. Fast switching between different bonding techniques is possible at any time and the manual mode enables fast bonding results without programming.

For a customized bonding result, the T-6000-L can be equipped with numerous options that can be added to the placement process at any time.

The T-6000-L guarantees reproducible and highly accurate results for any placement application and best bonding performance in the market. The unique manual mode enables instant DIE bonding.

This model covers all common bonding technologies and is designed to meet today’s and tomorrow’s challenges in semiconductor manufacturing.