• Your expert in microelectronics
  • Klastorpsvägen 11, 152 42 Södertälje

Description

Provides 3D, Telecentric and Microscopic Objective Options for applications such as: Surface Inspection, Die Inspection, Wirebond, Epoxy, +

Handling:

Magazines, Lead-Frames, Strips

Defect Marking Options:

Ink Marker on Head

Data Integration Options:

SECS-GEM, E142 Mapping, ELSR, AutoData


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