TANAKA offers everything concerning presius mettals. world largest Bonding wires producer.
High conductive silver clue, Thickfilm pastes, Platting targets and so on
Lineup of silver adhesive pastes with high thermal conductivity for different uses
Highly reliable automotive products with good records of performance
Alternative to high-temperature Pb solder pastes
Lineup of pastes, including lead free paste, in compliance with environmental regulations
The right paste can be chosen for the particular application
Integrated manufacturing, beginning with powdered materials, has enabled cost reductio
Target materials are free of pinholes, oxides and gases.
The quality of bonding with the backing plate is assured through ultrasonic flaw inspection.
High-purity precious metal vapor deposition materials are processed into granules, blocks, rods, wires and other forms.
Precision cleaned devices and jigs and reprocessed recycled precious metals can also be reprocessed into targets.
Grain sizes can be adjusted, from fine to coarse particles, according to your needs.
We offer various plating processes, including those using precious metal plating solutions, for various applications from semiconductor components to decorative articles. We offer highly productive plating processes with plating characteristics appropriate for their intended use.
TANAKA offers bonding wires and ribbons, such as gold (Au), silver (Ag), copper (Cu), and aluminum (Al) ultra-fine wires (10 to 38µm) as metal bonding materials and thick wires (100 to 500um) for power devices. Wires with smooth and clean surfaces that have excellent dimensional stability are provided together with solutions that include expertise on metal bonds.
Standards for Spools for Fine Bonding Wire & Ribbon
